Qualcomm is on the middle of development of its new platform, Snapdragon 855 Fusion. ICT industry puts a lot of faith in it and foresees that the chipset will become the base of high-end mobile solutions of the future. Already, Snapdragon 855 Fusion was mentioned in financial reports of a Japanese telecommunication media-corporation, SoftBank. The company is also working on something, which involves a Snapdragon 855 processor and a Snapdragon X50 5G modem.
However. Very little information is available yet. At this stage, we can only operate rumors. According to one, the new chipset will get no less than 8 processing cores and is going to deploy the 7-nm technology. It is expected that the product will appear on the market at the beginning of 2019. Regarding the modem, Snapdragon X50 5G is a module that supports communication via the 5th generation wireless connection that is capable of transferring gigabits of data per second.
It is unclear what justifies “Fusion” in the name of the platform. However, some specialists think that Snapdragon will be able to excel not only in mobile devices as smartphones and phablets (something between a phone and a tablet) but also in something bigger such as notebooks and hybrid portable systems.